In the realm of 2.5D packaging, which involves horizontally placing chips like CPUs, GPUs, I/O, and HBM on an intermediary layer, Samsung's expertise shines. While TSMC refers to its analogous technology as CoWoS, Samsung's version is known as I-Cube. Notably, NVIDIA's A100 and H100 leverage this innovative packaging approach, alongside Intel's Gaudi.

Samsung's proactive pursuit of clients for its 2.5D packaging services has been ongoing since the previous year. As part of their proposals to potential clients, Samsung emphasizes allocating ample personnel resources to the AVP team and leveraging their cutting-edge intermediary layer wafer designs.

Insider insights reveal that Samsung is poised to deliver 2.5D packaging solutions to NVIDIA, featuring four HBM chips. Moreover, Samsung boasts packaging capabilities accommodating up to eight HBM chips, demonstrating its technological prowess in this domain.

Recognizing the complexities involved in installing eight HBM chips on a 12-inch wafer, Samsung has innovated panel-level packaging technology for intermediary layers. This development aims to enhance production efficiency, a testament to Samsung's commitment to driving technological advancement.

NVIDIA's decision to entrust Samsung with this pivotal contract may stem from heightened demand for its AI chips, potentially straining the capacity of other providers like TSMC's CoWoS.

This order may also enable Samsung to win HBM chip orders.