April.11.2024
Samsung has recently announced its acquisition of a significant 2.5D packaging contract from NVIDIA, a leading player in the GPU market. This strategic move underscores Samsung's commitment to advancing its Advanced Packaging (AVP) capabilities by offering intermediary layer and I-Cube (2.5D packaging) services to GPU manufacturers.
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April.04.2024
On April 3, 2024, Taiwan experienced its strongest earthquake in recorded history, sending shockwaves through the global chip and semiconductor industry. The island, a crucial hub for the production of these vital components, faces significant challenges in the aftermath of the natural disaster.
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April.03.2024
In May of last year, the Chinese government banned the sale of Micron chips for government applications, citing unspecified cybersecurity concerns. Fast-forward to 2024, and Micron has announced the grand opening ceremony for a new Chinese chip packaging and testing plant — even though the aforementioned ban has not been lifted.
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April.01.2024
On March 27, Wolfspeed announced the topping out of construction at the its largest and most advanced John Palmour Manufacturing Center for Silicon Carbide.
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March.31.2024
SK Hynix is rumored planning to build an advanced packaging fab worth USD 4 billion in West Lafayette, Indiana. According to a report from The Wall Street Journal, it is expected to commence operations by 2028, creating up to 1,000 job opportunities. This initiative may receive support in the form of state and federal tax incentives.
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March.27.2024
Taiwan Semiconductor Manufacturing Company plans to have 100,000 employees around the world in a few years
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March.25.2024
March 24 (Reuters) - China has introduced guidelines to phase out U.S. microprocessors from Intel (INTC.O), opens new tab and AMD (AMD.O), opens new tab from government personal computers and servers, the Financial Times reported on Sunday.
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